A hierarchical model for characterising spatial wafer variations
نویسندگان
چکیده
منابع مشابه
Akrng wafer axis Hierarchical Modeling of Spatial Variability with a 45nm Example
In previous publications we have proposed a hierarchical variability model and verified it with 90nm test data. This model is now validated with a new set of 45nm test chips. A mixed sampling scheme with both sparse and exhaustive measurements is designed to capture both wafer level and chip level variations. Statistical analysis shows that the acrosswafer systematic function can be sufficientl...
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ژورنال
عنوان ژورنال: International Journal of Production Research
سال: 2013
ISSN: 0020-7543,1366-588X
DOI: 10.1080/00207543.2013.849389